Technology
Micro electronics

Business Activity
PacTech GmbH offers services and products for wafer level manufacturing and wafer level packaging equipment.

Products and Services
WLP services: electroless nickel, solder bumping, backend & assembly, flip chip test wafer; Equipment: electroless nickel plating, solder bumping, wafer level rework, photovoltaic, ATV equipment

PacTech GmbH
Am Schlangenhorst 15-17
14641 Nauen
Germany

Contact:
Dr. Elke Zakel
Phone: +49 (0) 3321 / 4495-100
Fax: +49 (0) 3321 / 4495-124
zakel@pactech.de